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472 1 p c 1 2 2 f 2 5 7 8 6 3 4 k 2 m a g s ? 1 5 goyordering code ;my applications ??y features ~ ~ ?p
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qu?m ~ ???vu??o ?^m ~
i?0?u??o ?^m ??a?? spark gaps operating temp. ?30?85? ag ??a?? ? ? y6 6 l??y?0) |v 4 8 f g ?500 ?800 ??? y |mm k2m k2u k4m k4u y k ????? k ????? k ????? k ????? 5.0 5.0 6.4 6.4 ?^ 20? 5.0?1 20? 5.0?1 0.60 0.60 0.60 0.60 2 ? y 15 ?
go?w?? p ???? % 3 %p? 5 ? ?l????y |vdc 7 a
~ crt *%w? ?yu ) 1?? s ? 15 ??o ? >g? b ? 15??a?e?? ? 1?? %???s` c %??? ? 122 1200 252 2500 ~ very safe due to self-extinguishing resin ~ leakage current is very small. ~ electrostatic capacitance is very small. ~ used to absorb abnormal voltages in the periphery of a crt ag spark gaps type coating conditions 6 4 8 lead con?guration |mm k2m k2u k4m k4u lead type k-formed k-formed k-formed k-formed lead space 5.0 5.0 6.4 6.4 length 20min. 5.0?1 20min. 5.0?1 diameter 0.60 0.60 0.60 0.60 2 external dimension 15 p alkyd resin 3 resin material 7 6 packaging s ? type 15, bulk b ? type 15, taped 1 blank space without resin cap c with resin cap 1 type by external dimen - sion 122 1200 252 2500 nominal discharge starting voltage |vdc discharge voltage tolerance |v f g ?500 ?800 1 blank space 5 1
surge absorbers 8 473 p. 473 ??aa part numbers ?
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$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions p. 474 p. 475 p. 476 p. 478 ?3???? selection guide p. 14 etc ?
goyexternal dimensions ag15 k????? formed k2m,k2u,k4m,k4u type ???
lead type ??aay part numbersy w?tx ? ? y6ztxl????yz?tx?0)z?txa
ztx??? yg?u???b{ ?please specify the coating condition code and the discharge starting voltage code and ? the tolerance code and ? the packaging code and the lead con?guration code. ? ?;`om?p?x~ ?p
q %pzul94 v-0zul1410 phase ll f
m ?- ab??wpb{ note the material used is a self-extinguishing resin conforming to ul94 v-0 and ul1410 phase ll regulation yyy?1 ag15xdc500v20 ?ow?pb{ unitmm inch ?ty capless ?ty ?v capped ?.w^ thickness of body3.5max 0.138max ?.w^ thickness of body4?0.5 0.157?0.020 ?1 values of ag15 are set at dc500v within 20 seconds. y type l????y discharge starting voltage dc ? ?? nominal value |v 1200y1500y2000 2500 ?0) tolerance |v ? 500 ? 800
? ? insulation resistance |m
?1 ??? y lead con?guration k ????? k formed ag15p???? ehs environmental hazardous substances rohs 10000min
474 ?
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$yelectrical characteristics
surge absorbers 8 475 ay packaging 7 ? !?o?
: minimum quantity type ag15 >g? bulk 1000 a?e?? taped 1300t 7 ? !?o?
: minimum quantity |pcs tk2m??w? g? symbol a b t p p 0 p 1 p 2 f w w 0 w 1 w 2 h h 0 d 0 l y t h1 h2 d 6.8?0.5 0.268?0.020 7.0?0.5 0.276?0.020 4.0?0.5 0.157?0.020 12.7?1.0 0.500?0.039 12.7?0.3 0.500?0.012 3.85?0.5 0.152?0.020 6.35?1.3 0.250?0.051 5.0?0.5 0.197?0.020 18.0 0.709 y 12.0min 0.472min 9.0 0.354 3.0max 0.118max 19.6?0.5 0.772?0.020 16.0?0.5 0.630?0.020 4.0?0.3 0.157?0.012 11.0max 0.433max 2.0max 0.079max 0.75?0.2 0.030?0.008 2.0max 0.079max 0.6?0.05 0.024?0.002
go dimensions 0.039 ?0.020 0.75 ? 0.5 1.0 ?0.5 0.030 ? 0.020 a?e??
goy k2m?? y taping dimensions k2 m type t available for k2m type only unitmm inch
surge absorbers 8 477 reliability data spark gaps speci?ed value item test methods and remarks 1 .operating temperature range 2.operating humidity range 3 .storage temperature yrange 4 .discharge voltage 5.insulation resistance 6.capacitance 7 .discharge ylife 8.damp heat 9 .terminal y strength tensile torsional no damage no damage ?30??85? 95%rh max. no dew condensation ?40??85? within the speci?ed tolerance 10,000 m
min. 1pfmax. with the circuit 1 shown below, conduct measurement with voltage application. applied voltage500vdc durationwithin 20 sec. measuring frequency 1?0.1mhz measuring voltage0.5?5.0 vrms bias applicationnone with the circuit 2 shown below, repeat discharge with speci?ed voltage, followed by the measurement within 2 to 5 hrs. number of discharge 10,000 times temperature 40?2? humidity90?95?rh duration250 hrs recovery2 to 5 hrs of recovery under the standard condition after the removal from test chamber. apply the tensile force in the direction to draw terminal. applied force 9.8n apply the bending force to incline the body to right and left through angle of 90? applied force 4.9n circuit 2 circuit 1 note on standard condition: "standard condition" referred to herein is de?ned as follows: 5 to 35? of temperature, 45 to 85 % relative humidity and 86 to 106 kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted under condition of 20?2? of temperature, 60 to 70 % relative humidity and 86 to 106 kpa of air pressure. unless otherwise speci?ed, all the tests are conducted under the "standard condition." discharge voltage change insulation resistance discharge voltage change insulation resistance 5000m
5000m
? ?35 20 ?30 50 ag15 r20m
c10000pf erefer to individual speci?cation ag15 r20m
c2000pf ?
precautions surge absorbers 8 479 1/2 technical considerations stages precautions precautions on the use of spark gaps 1 . circuit design veri?cation of operating environment, electrical rating and per - formance 1 . a malfunction in medical equipment, spacecraft, nuclear reac - tors, etc. may cause serious harm to human life or have severe social rami?cations. as such, any spark gaps to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from com - ponents used in general purpose applications. veri?cation of rated voltage dc rated voltage 1 . spark gaps has determined electric discharge voltage be - tween metaled electrode using the insulation resistance of air. therefore, since a life changes with the energies of input serge, please give me examination enough in the case of use. 2 . since between the electrode will be in a short state at the time of electric discharge, when using it for a low impedance circuit, the follow current occurs and reduce the life of spark gaps remarkably. in such a case, please connect low resistance or a capacitive varistor in series. 3 . since the voltage which starts electric discharge when the early serge of a standup is actually impressed, since electric discharge delay generates spark gaps may become higher than the speci?ed electric discharge start voltage, cautions are required. 4 . since spark gaps was developed for serge with small energy, when using it as an object for guidance thunder absorption with the big energy generated on a commercial power supply line, telephone / communication line, etc., it requires cautions enough. operating environment precautions 1 . spark gaps should not be used in the following environments: 1 environmental conditions to avoid a. exposure to water or salt water. b. exposure to moisture or condensation. c. exposure to corrosive gases such as hydrogen sul?de, sulfu - rous acid, chlorine, and ammonia 2. pcb design 1 . when spark gaps are mounted onto a pc board, hole dimen - sions on the board should match the lead pitch of the compo - nent, if not it will cause breakage of the terminals or cracking of terminal roots covered with resin as excess stress travels through the terminal legs. as a result, humidity resistance performance would be lost and may lead to a reduction in insulation resistance and cause a withstand voltage failure. 3 . considerations for automatic insertion adjustment automatic insertion machines leaded components 1 . when inserting spark gaps in a pc board by auto-insertion machines the impact load imposed on the capacitors should be minimized to prevent the leads from chucking or clinching.
precautions surge absorbers 8 481 4. soldering selection of flux 1 . when soldering spark gaps on the board, ?ux should be applied thinly and evenly. 2 . flux used should be with less than or equal to 0.1 wt% equivalent to chroline of halogenated content. flux hav - ing a strong acidity content should not be applied. 3 . when using water-soluble ?ux, special care should be taken to properly clean the boards. wave soldering 1 .temperature, time, amount of solder, etc. are speci?ed iny accordance with the following recommended conditions. 2 . do not immerse the entire spark gaps in the ?ux during the soldering operation. only solder the lead wires on the bot - tom of the board. 1 . flux is used to increase solderability in wave soldering, but if too much is applied, a large amount of ?ux gas may be emitted and may detrimentally affect solderability. to minimize the amount of ?ux applied, it is recommended to use a ?ux-bubbling system. 2 . with too much halogenated substance chlorine, etc. content is used to activate the ?ux, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 3 . since the residue of water-soluble ?ux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. the clean - ing methods and the capability of the machines used should also be considered carefully when selecting water-soluble ?ux. 1 . if spark gaps are used beyond the range of the recommended conditions, heat stresses may cause cracks inside the spark gaps, and consequently degrade the reliability of the spark gaps. 5. cleaning board cleaning 1 . when cleaning the mounted pc boards, make sure that cleaning conditions are consistent with prescribed usage conditions. 1 . the resin material used for the outer coating of capacitors is occasionally a wax sub - stance for moisture resistance which can easily be dissolved by some solutions. so before cleaning, special care should be taken to test the component ? s vulnerability to the solutions used. when using water-soluble ?ux please clean the pcb with puri?ed water suf?ciently and dry thoroughly at the end of the process. insuf?cient washing or drying could lower the reliability of the capacitors. 6 . post-cleaning-process application of resin molding, etc. to the pcb and compo - nents. 1 . please contact your local taiyo yuden sales of?ce before performing resin coating or molding on mounted capacitors. please verify on the actual application that the coating pro - cess will not adversely affect the component quality. 2/2 1 - 1 . the thermal expansion and coef?cient of contraction of the molded resin are not nec - essarily matched with those of the spark gaps. the spark gaps may be exposed to stresses due to thermal expansion and contraction during and after hardening. this may lower the speci?ed characteristics and insulation resistance or cause reduced withstand voltage by cracking the ceramic or separating the coated resin from the ceramics. 1 - 2 . with some types of mold resins, the resin's decomposition gas or reaction gas may remain inside the resin during the hardening period or while left under normal conditions, causing a deterioration of the capacitor's performance. 1 - 3 . some mold resins may have poor moisture proo?ng properties. please verify the con - tents of the resins before they are applied. 1 - 4 . please contact taiyo yuden before using if the hardening process temperature of the mold resins is higher than the operating temperature of the spark gaps. technical considerations stages precautions precautions on the use of spark gaps mechanical considerations 1 . be careful not to subject the spark gaps to excessive me - chanical shocks. withstanding voltage failure may result. 2 . if spark gaps are dropped onto the ?oor or a hard surface they should not be used. 1 . because the spark gaps is made of ceramic, mechanical shocks applied to the board may damage or crack the spark gaps. 2 .spark gaps which are dropped onto the ?oor or a hard surface may develop defects and have a higher risk of failure over time. 7. handling 1 . under high temperature/high humidity conditions, the decrease in solderability due to the oxidation of terminal electrodes and deterioration of taping and packaging char - acteristics may be accelerated. storage 1 . to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. hu - midity should especially be kept as low as possible. recom - mended conditions: ambient temperature below 40 ? humid - ity below 70 % rh. products should be used within 12 months after delivery. after the above period, the solderability should be checked before using the spark gaps. 2 . spark gaps should not be kept in an environment ?lled with decomposition gases such as sulfurous hydrogen, sulfurous acid, chlorine, ammonia, etc. 3 . spark gaps should not be kept in a location where they may be exposed to moisture, condensation or direct sunlight. 8. storage conditions

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